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Wafer Processing
As one of the largest back-end toll processing company in Korea.
Back Grinding
Back Grinding Process
반도체 패키지 경량화를 위해 웨이퍼 뒷면을 휠을 이용하여 연삭, 연마함으로써 웨이퍼 두께를 줄이는 공정
연삭 후 절삭 공정 진행을 위해 테이프가 부착된 링 프레임에 웨이퍼를 접착시킴
| Wafer Size Coverage | Clean Room | Thin Wafer Target Thickness | Thickness Tolerance after Grinding | Roughness Rmax |
|---|---|---|---|---|
| 8" / 12" | Class 500 | 50㎛ ↑ | ± 10㎛ | ± 0.3㎛ |
Address : 283, Sandan-ro, Danwon-gu, Ansan-si, Gyeonggi-do, Republic of Korea
Tel: 031-428-2500 Fax : 031-454-1172
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