As one of the largest back-end toll processing company in Korea.
장비 외관검사를 통해 칩 표면 상 양/불을 판별하는 공정
Wafer Size Coverage | 8" / 12" |
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Clean Room | Class 10 / Class 100 |
Bad Die Recognition | Wafer Map Exporting / Ink Dotting |
Detectability | 1.0㎛ |
Types of Defects |
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