As one of the largest back-end toll processing company in Korea.
높은 생산성 이란 즉 좋은 작업환경, 구성원들의 경험 및 통합된 시스템의 운영이라는 세 가지 요소의 결합이 만들어내는 산물이라고 할 수 있습니다.
이러한 요소들과 퓨렉스의 다양한 경험들을 접목하여 최고의 생산성을 약속하겠습니다.
Process | Machine Maker | Model | Key Control Item |
---|---|---|---|
Lamination | Dynatech | DT_ECS2030 | Tape Void, Burr, etc |
CUON Solution | CUWLA-120 | ||
Back Grinding | TSK | PG300RM | Target Thickness Roughness Broken, Crack, etc |
DISCO | DGP8760 DGP8761 |
||
Laser grooving | DISCO | DFL-7161 | Speed, RPM, Height, Chxipping, Particle, Pixel Damage, etc |
Dicing | TSK | 3000T | |
DISCO | DFD6361 | ||
Die Sort | BESI (Laurier) |
DS9000 / 9100 | Map, Die-to-Die Gap. Rotation Collet Damage, etc |
DS9000E | |||
QMC | CCS-310 | ||
Cleaning | DISCO | DFD651 | Pressure, TIme, etc |
AVI | CAMTEK | Falcon | Recipe, Visual Defects, etc |
Condor | |||
Eagle-1 | |||
STI | I Focus 100 |
Process | Machine Maker | Model | Key Control Item |
---|---|---|---|
Lamination | Dynatech | DT-ECS2030 | Tape Void, Burr, etc |
CUON Solution | CUWLA-120 | ||
Back Grinding | DISCO | DGP8761 | Target Thickness, Roughness Broken, Crack, etc |
Wafer Mounting | Dynatech | DT-NWM1050DM | Tape Void, Broken, Crack, etc |
Back Marking (Option) |
EO Tech | CSM3000FC | Wrong Mark, No Mark, Shift, etc |
Plasma (Option) |
Jesagi | JSPCS-700M | Time, etc |
Dicing | DISCO | DFD6361 | Speed, RPM, Height Chipping, Particle, etc |
DFD6340 | |||
TSK | 3000T | ||
300TX | |||
AVI | CAMTEK | 530PD | Recipe, Visual Defects, etc |
520PD | |||
UV | Daesung | DSUV-128 | UV Intensity, etc |
APS | AJU Hitech | AVS-8100 | Map, Quantity, Iik Die, Collet Damage, etc |
AP Tech | APP-L10 | ||
JT Corp. | JAP-3000 | ||
GPM | KG-812-1B | ||
Tray AVI | JT Corp. | JAI-D302 | Recipe, Visual Defects, etc |
Hon Tech | HT-1200 | ||
Packing | Unicom | TAPIT_W Ⅱ+ | Tape Banding condition, etc |
Air Zero | AZCW-750D | MBB Vacuum sealing condition, etc |