utility menu
Wafer Processing
As one of the largest back-end toll processing company in Korea.
Back Grinding
Back Grinding Process
| Wafer Size Coverage | Clean Room | Thin Wafer Target Thickness | Thickness Tolerance after Grinding | Roughness Rmax |
|---|---|---|---|---|
| 8" / 12" | Class 500 | 50㎛ ↑ | ± 10㎛ | ± 0.3㎛ |
Address : 283, Sandan-ro, Danwon-gu, Ansan-si, Gyeonggi-do, Republic of Korea
Tel: 031-428-2500 Fax : 031-454-1172
COPYRIGHT(C) 2017 FuRex
Back to top