About Us
Company Profile
Brand Promise
Building Structure
Valuable Partners
Corporate Culture
Industries We Serve
CIS
DDIC
MCU
CIS Module Package
Laser Drilling
Manufacturing Capabilities
Capacity
Lineup By Process
Wafer Processing
Back Grinding
Wafer Dicing
Die Sort
AVI
Quality Commitment
Division of Work
Quality Management
Quality Policy
Certification
Environment Control
Reliability Capability
Etc
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Manufacturing Capabilities

As one of the largest back-end toll processing company in Korea.

Home Manufacturing Capabilities Lineup By Process

Lineup By Process

DDIC

  1. LaminationLamination
  2. BacklapBacklap
  3. B. MarkingB. Marking
Process Manufacturer Model Key Control Item
Lamination Dyna Tech DT-ECS2030 Tape void / Burr
CUON Solution CUWLA-120
Backlap TSK PG300RM Target thickness / Roughness / Broken / Crack
DISCO DGP8760 / 8761
Mounting Dyna Tech DT-NWM1050DM Tape void / Broken / Crack
Back marking EO Tech CSM3000 Wrong mark / Shift
  1. PlasmaPlasma
  2. DicingDicing
  3. AVIAVI
Process Manufacturer Model Key Control Item
Plasma Dyna Tech JSPC-700 Time
Dicing TSK AD3000T Speed / RPM / Height / Chipping / Particle / Pixel damage
300TX
DISCO DFD6361
DFD6340
AVI CAMTEK 520 / 530PD Recipe / Visual defects
  1. UVUV
  2. APSAPS
  3. Tray AVITray AVI
Process Manufacturer Model Key Control Item
UV Daesung DSUV-128 UV intensity
APS AJU Hitech AVS-8100 Map / Quality / Ink die / Collet damage
AP Tech APP-L10
JT Corp JAP-3000
GPM KG-812-1B
Tray AVI JT Corp JAI-D302 Recipe / Visual defects
Hon Tech HT-1200

CIS

  1. LaminationLamination
  2. BacklapBacklap
  3. DicingDicing
Process Manufacturer Model Key Control Item
Lamination Dyna Tech DT-ECS2030 Tape void / Burr
CUON Solution CUWLA-120
Backlap TSK PG300RM Target thickness / Roughness / Broken / Crack
DISCO DGP8760 / 8761
Laser grooving DISCO DFL7161 -
Dicing TSK AD3000T Speed / RPM / Height / Chipping / Particle / Pixel damage
DISCO DFD6361
  1. ReconstructionReconstruction
  2. CleaningCleaning
  3. AVIAVI
Process Manufacturer Model Key Control Item
Reconstruction Laurier DS9000 Map / Die-to-Die Gap / Rotation / Collet damage
DS9100 / 9000E
QMC CCS-310
Cleaning DISCO DFD651 Pressure / Time
AVI CAMTEK 103M PD Recipe / Visual defects
530PD
Eagle-1
STI IFOCUS100

CIS PKG

  1. Die attachDie attach
  2. Wet cleanerWet cleaner
  3. Wire BondingWire Bonding
Process Manufacturer Model Key Control Item
Die attach Alphasem SL-9002 Rotation / Coverage / Warpage
SL-9022
Wet cleaning Fujitsu FCS-3000A Time / Ultra sonic(㎑)
Wire bonding K&S Max㎛ Plus BPT / BST / NDPA / Ball thickness / Size
  1. Glass attachGlass attach
  2. Oven cureOven cure
  3. Laser markingLaser marking
Process Manufacturer Model Key Control Item
Glass attach EM Tech EM-CC01-M Visual defects
(FM / stain / scratch)
Oven cure Clean Thermo CCO-01 Temperature / Particles
Laser marking LPG laser LPG-25 Barcode contamination
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