About Us
Company Profile
Brand Promise
Building Structure
Valuable Partners
Corporate Culture
Industries We Serve
CIS
DDIC
MCU
CIS Module Package
Laser Drilling
Manufacturing Capabilities
Capacity
Lineup By Process
Wafer Processing
Back Grinding
Wafer Dicing
Die Sort
AVI
Quality Commitment
Division of Work
Quality Management
Quality Policy
Certification
Environment Control
Reliability Capability
Etc
contact us
close sitemap

Quality Commitment

As one of the largest back-end toll processing company in Korea.

Home Quality Commitment Reliability Capability

Reliability Capability

Our R&D and QA team are capable of conducting various reliability test.
As you see in the page we have obtained various testing equipments in order to provide precise and accurate data.

  • Visual Inspection
    • Measuring micro

      Measuring micro

    • High power scope

      High power scope

    • Low power scope

      Low power scope

    • FE – SEM / EDX

      FE – SEM / EDX

  • Performance
    Test
    • Vibration

      Vibration

    • Drop

      Drop

    • Roughness

      Roughness

    • Thickness

      Thickness

  • Reliability
    Test
    • Thermal shock

      Thermal shock

    • Temp& Humidity

      Temp& Humidity

As you see, these are the examples of the scope of our reporting.
Having such feedback process we strive to find the issues as early as possible, respond to the issues as early as possible.

AVI output, Scope output (x500), SEM / EDX

Reliability

  • Temp& Humidity

    Vibration Tester
    Green Science
    Vibration 10~100HZ

  • Temp& Humidity

    Drop Tester
    ODM
    Max 1.7M

  • Temp& Humidity

    Temp
    & Humidity chamber
    SJ-109 (So Jung)
    -20℃ ~ +120℃ / 30 ~ 98%RH

  • Temp& Humidity

    Thermal
    Shock Chamber
    SJ-TS2 (So Jung)
    Temp range: -70℃ ～ +180℃

  • Temp& Humidity

    Pressure
    Cooker Tester
    PCT-48 (이레테크)
    Temp range: 80℃ ～ 130℃

  • Temp& Humidity

    Wire Bond Tester
    Dage4000 (Nordson)
    Wire bond pull,
    ball shear, die shear

Failure Analysis

Thermal Field Emission-SEM
(Scanning Electron Microscope)
Failure Analysis

- Model: JSM7610 (JEOL)
- Resolution : 1.0nm at 15kV, 1.5nm at 1kV
- Magnification: X25 to X1,000,000
- Accelerating Voltage : 0.1kV to 30kV

FE-SEM is a tool for physical analysis. It uses very high magnification without charging or
damaging the device with their high beam currents, so It is possible to observe the fine surface
morphology of nanostructure and to obtain compositional and structural analysis.

Back to top