site menu
About Us
Company Profile
Brand Promise
Building Structure
Valuable Partners
Corporate Culture
Industries We Serve
CIS
DDIC
MCU
CIS Module Package
Laser Drilling
Manufacturing Capabilities
Capacity
Lineup By Process
Wafer Processing
Back Grinding
Wafer Dicing
Die Sort
AVI
Quality Commitment
Division of Work
Quality Management
Quality Policy
Certification
Environment Control
Reliability Capability
utility menu
WEB MAIL
CONTACT US
ENGLISH
KOREAN
ENGLISH
About Us
Company Profile
Brand Promise
Building Structure
Valuable Partners
Corporate Culture
Industries We Serve
CIS
DDIC
MCU
CIS Module Package
Laser Drilling
Manufacturing Capabilities
Capacity
Lineup By Process
Wafer Processing
Back Grinding
Wafer Dicing
Die Sort
AVI
Quality Commitment
Division of Work
Quality Management
Quality Policy
Certification
Environment Control
Reliability Capability
Etc
contact us
Wafer Processing
As one of the largest back-end toll processing company in Korea.
Wafer Processing
Die Sort
Die Sort
Die Sort Process
Die Sort
Wafer-In Size
Ring-Out Size
Waffle Pack Size
Clean Room
Die-to-Die Gap
Die Rotation
8" / 12"
8" / 12"
2" / 3" / 4"
Class 10 / Class 100
± 100㎛
< 1°
Back to top