Wafer Processing
As one of the largest back-end toll processing company in Korea.
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Auto Visual Inspection
Wafer Size Coverage |
8" / 12" |
Clean Room |
Class 10 / Class 100 |
Bad Die Recognition |
Wafer Map Exporting / Ink Dotting |
Detectability |
1.0㎛ |
Types of Defects |
- Metallization defects
- Glassivation, passivation defects
- Polyimide, BCB defects
- Embedded foreign material
- Dicing defects
- Bump defects
- Contamination defects such as liquid residues, surface particles, and adhesive residues
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